Application deadline: 1 March
The ISSP Riga Residency programme is aimed at a diverse range of photographers and artists using the medium of photography, primarily based in the Nordic – Baltic region. We welcome those interested in exploring the social, cultural and historical context of Riga in the framework of their artistic practice. During stays of up to two months, the residency programme provides the opportunity for concentrated work on a project informed by interaction with the city and its residents. The visiting artists will be introduced to the local audience in a public artist talk, and we encourage collaboration with local artists, community groups and cultural organisations. Based in Riga, the capital of Latvia and the largest city in Baltics, the residency also offers a culturally intense experience and opportunity to explore the region.
The Riga Residency is curated by ISSP – a platform for contemporary photography, based in Riga, but acting internationally, and invites the participating artists to benefit from its international network and get involved in its activities and education programme.
The artists-in-residence will receive free of charge accommodation in a comfortable apartment for the duration of their stay.
Please note: The Nordic Culture Point supports the following expenses for artists living in the Nordic – Baltic region only (Denmark, Finland, the Faroe Islands, Greenland, Iceland, Norway, Sweden, Åland, Estonia, Lithuania):
– travel costs (up to 200 EUR per artist)
– 500 EUR stipend for the development of work
Artists from other countries are not eligible for this support, but may apply if they can secure means to support their residency from own sources.
The residency will also cover exhibition production costs in case the resulting work is chosen to feature in an exhibition concluding the ISSP Riga Residency programme in 2019. The programme will start in May 2018.
For more information and application details: issp.lv/en/residencies
Open Call | ISSP Riga Photography Residency, Latvia